Electronic device having a curved profile interface corresponding to a recess

ABSTRACT

An electronic device is provided. The electronic device includes a substrate having an edge, an active region located on the substrate, a convex portion disposed between the edge and the active region, a first inorganic layer disposed on the substrate and the convex portion, a second inorganic layer disposed on the first inorganic layer, wherein the first inorganic layer directly contacts the second inorganic layer at an end which is located between the convex portion and the edge, and an organic layer disposed between the first inorganic layer and the second inorganic layer, and between the end and the convex portion.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of pending U.S. patent applicationSer. No. 16/944,151, filed Jul. 31, 2020 and entitled “ELECTRONIC DEVICEHAVING A CURVED PROFILE INTERFACE CORRESPONDING TO A RECESS”, theentirety of which is incorporated by reference herein.

BACKGROUND OF THE DISCLOSURE Field of the Disclosure

The disclosure relates to an electronic device, and particularly to astructure in a periphery region of a display panel.

Description of the Related Art

It is necessary to reinforce the structure in a periphery region of asoft display panel to reduce the possibility that the display panel isstripped due to bending. In this disclosure, a new structure in theperiphery region is provided, and the process yield is increased becauseof the enhancement of the structure.

BRIEF DESCRIPTION OF THE DISCLOSURE

An electronic device is provided in some embodiments of the presentdisclosure. The electronic device includes a substrate having an edge,an active region located on the substrate, a convex portion disposedbetween the edge and the active region, a first inorganic layer disposedon the substrate and the convex portion, a second inorganic layerdisposed on the first inorganic layer, wherein the first inorganic layerdirectly contacts the second inorganic layer at an end which is locatedbetween the convex portion and the edge, and an organic layer disposedbetween the first inorganic layer and the second inorganic layer, andbetween the end and the convex portion.

BRIEF SUMMARY OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It shouldbe noted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a top view of an electronic device in some embodiments of thepresent disclosure.

FIG. 2 is a cross-sectional view of the electronic device in someembodiments of the present disclosure.

FIG. 3 is a cross-sectional view of a recess in some embodiments of thepresent disclosure.

FIG. 4 is a cross-sectional view of a recess in some embodiments of thepresent disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare in direct contact, and may also include embodiments in whichadditional features may be disposed between the first and secondfeatures, such that the first and second features may not be in directcontact.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a feature on, connected to, and/or coupled toanother feature in the present disclosure that follows may includeembodiments in which the features are in direct contact, and may alsoinclude embodiments in which additional features may be disposedinterposing the features, such that the features may not be in directcontact. In addition, spatially relative terms, for example, “vertical,”“above,” “over,” “below,”, “bottom,” etc. as well as derivatives thereof(e.g., “downwardly,” “upwardly,” etc.) are used in the presentdisclosure for ease of description of one feature's relationship toanother feature. The spatially relative terms are intended to coverdifferent orientations of the device, including the features.

Use of ordinal terms such as “first”, “second”, etc., in the claims tomodify a claim element does not by itself connote any priority,precedence, or order of one claim element over another or the temporalorder in which acts of a method are performed, but are used merely aslabels to distinguish one claim element having a certain name fromanother element having the same name (but for use of the ordinal term)to distinguish the claim elements.

In addition, in some embodiments of the present disclosure, termsconcerning attachments, coupling and the like, such as “connected” and“interconnected”, refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, as well as both movable or rigid attachments orrelationships, unless expressly described otherwise.

Refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a top view of anelectronic device 100 in some embodiments of the present disclosure, andFIG. 2 is a cross-sectional view of the electronic device 100 in someembodiments of the present disclosure. The electronic device 100 may bea display device, and a panel of the display device may include asubstrate, such as a soft substrate or a flexible substrate, but thepresent disclosure the present disclosure is not limited thereto. Thedisplay device may include liquid crystal (LC) display devices, organiclight-emitting diode (OLED) display devices, quantum dot (QD) displaydevices, fluorescent material display devices, phosphor material displaydevices, light-emitting diode (LED) display devices, such as mini LED ormicro LED display devices, or other display devices. It should be notedthat organic light-emitting diode display devices are used as examplesof the electronic device in the present disclosure for illustration, butthe present disclosure is not limited thereto. For example, theelectronic device may be a sensing device, an antenna device, acombination thereof, or a tiled electronic device.

As shown in FIG. 1 , the electronic device 100 may include an activeregion 1A, a dummy thin-film transistor region (dummy TFT region) 1B, awiring region 1C, an overflow region 2, and a package region 3, but thepresent disclosure is not limited thereto. In this disclosure, theactive region 1A may include a plurality of wirings, a plurality oftransistors, and a plurality of electrodes to form electronic elements,such as the sub-pixels in a display device, but not limited thereto. Insome embodiments, the active region 1A, the dummy TFT region 1B, and thewiring regions 1C may be called as a device region 1. In someembodiments, the electronic device 1 may include other regions,depending on design requirements.

As shown in FIG. 2 , the electronic device 100 may mainly include asubstrate 10, a buffer layer 18, an inorganic layer I (which may includea first inorganic layer 15 and/or a second inorganic layer 16), and anorganic layer O (which may include a first organic layer 30 and/or asecond organic layer 17), a light-emitting diode layer (not shown), anda reflective electrode layer (not shown) in a cross-sectional view, butit is not limited thereto. In some embodiments, an electronic element 14may be disposed on the device region 1, such as the active element. Forexample, as shown in FIG. 2 , the electronic elements 14 may be disposedon the substrate 10, and the buffer layer 18 may be located between theelectronic element 14 and the substrate 10. In some embodiments, a coverlayer 40 may be disposed above a first organic layer 30. For example,the cover layer 40 may include a touch control layer, a polarizinglayer, a protective layer (such as glass), other suitable layers or acombination thereof, but the present disclosure is not limited thereto.

In some embodiments, when the electronic device 100 is a display device,the active region 1A may be a display region, and the dummy TFT region1B, the wiring region 1C, the overflow region 2, and the package region3 may be a periphery region (or a non-display area), but the presentdisclosure is not limited thereto. The periphery region may be locatedat an edge region of a display panel. Alternatively, if a through holeis formed on the display panel (such as the through hole on a displaypanel of a cell phone for a camera module), the periphery region may belocated at a border region between the through hole and the displayregion. In some embodiments, the width of the periphery region (such asthe total width of the dummy TFT region 1B, the wiring region 1C, theoverflow region 2, and the package region 3 in FIG. 1 ) may be less than1 mm to reduce the width of the bezel of the display device. In someembodiments, the periphery region may include other features, dependingon design requirements. In some embodiments, the width of the packageregion 3 (such as the width in X direction) may be less than about 400μm, but the present disclosure is not limited thereto.

The substrate 10 may include a plurality of recesses in the peripheryregion, such as a recess 20, a recess 22, and/or a recess 24. The numberof the recess 20, the recess 22, and the recess 24 in FIG. 1 and FIG. 2is only for illustration, and the number of the recess 20, the recess22, and the recess 24 may be changed based on design requirements. Forexample, as shown in FIG. 1 and FIG. 2 , the substrate 10 may include aplurality of recesses 20, a recess 22, and a recess 24, but the presentdisclosure is not limited thereto. Referring to FIG. 3 and FIG. 4 , therecess may include side portions (such as the side portions 20A of therecess 20 or the side portions 22A of the recess 22, etc.) and a centralportion (such as the central portion 20B of the recess 20 or the centralportion 22B of the recess 22, etc.), which will be described in detaillater. In some embodiments, the substrate 10 may be bent by force. Insome embodiments, the substrate 10 may include suitable flexiblematerials, such as polycarbonate, polyimide, polypropylene, polyethyleneterephthalate, other suitable materials or a combination thereof, butthe present disclosure is not limited thereto.

As shown in FIG. 2 , the inorganic layer I may be disposed on thesubstrate 10, and the first organic layer 30 may be disposed on theinorganic layer I. For example, the first inorganic 15 may be disposedon the substrate 10, and the second organic layer 17 may be disposed onthe first inorganic layer 15. The second inorganic layer 16 may bedisposed on the substrate 10, and a portion of the first inorganic 15may be disposed between the second inorganic layer 16 and the substrate10, such as shown at the left side of FIG. 2 , or a portion of the firstinorganic layer 15 and at least a portion of the second organic layer 17may be located between the second inorganic layer 16 and the substrate10, as shown at the right side of FIG. 2 , it depends on designrequirements. Furthermore, in some embodiments, at least a portion ofthe first organic layer 30 may be disposed on the first inorganic layer15 and/or the second inorganic layer 16. In some embodiments, a portionof the first inorganic layer 15, a portion of second inorganic layer 16,and a portion of the first organic layer 30 may be disposed in therecess 20 and/or the recess 24, but the present disclosure is notlimited thereto.

In some embodiments, the first inorganic layer 15 and the secondinorganic layer 16 may include an identical material or differentmaterials, but the present disclosure is not limited thereto. Forexample, the first inorganic layer 15 and/or the second inorganic layer16 may be formed by tetraethylorthosilicate (TEOS), O₂, Ar, NF₃, SiH₄,N₂O, NH₃, N₂, other suitable materials, or a combination thereof, butthe present disclosure is not limited thereto. In some embodiments, thefirst inorganic layer 15 and/or the second inorganic layer 16 may beformed by physical vapor deposition (PVD) process, chemical vapordeposition (CVD) process, coating, other suitable methods, or acombination thereof. For example, the physical vapor deposition processmay include sputtering, vapor deposition, pulsed laser deposition, etc.,but the present disclosure is not limited thereto. For example, thechemical vapor deposition process may include low-pressure CVD (LPCVD),low-temperature CVD (LTCVD), rapid-thermal CVD (RTCVD), plasma-enhancedCVD (PECVD), or atomic layer deposition (ALD), but the presentdisclosure is not limited thereto.

In some embodiments, the first organic layer 30 and the second organiclayer 17 may include different materials, but the present disclosure isnot limited thereto. For example, the material or the first organiclayer 30 may include epoxy acrylates, polyester acrylate, urethaneacrylate, photosensitive polyimide, phenolic epoxy resin, siloxane,other suitable materials, or a combination thereof, but the presentdisclosure is not limited thereto. The second organic layer 17 mayinclude flowable glue, or may include pressure sensitive adhesive, heatcuring adhesive, light curing adhesive, hot melt adhesive, moisturecuring adhesive, AB glue, etc., but the present disclosure is notlimited thereto. In some embodiments, the first organic layer 30 and thesecond organic layer 17 may include identical materials.

In some embodiments, the substrate 10 may further include a convexportion 11 disposed on a top surface of the substrate 10, and the convexportion 11 may be located between the recess 22 and the recess 24, to bemore specific, the recess 24 is located between the recess 20 and theconvex portion 11. The convex portion 11 at least partially overlaps thesecond organic layer 17 in the normal direction of the substrate 10(i.e. Z direction). The possibility that the flowable second organiclayer 17 flows into the recess 20 at the package region 3 will bereduced by providing the convex portion 11, the recess 22, and therecess 24 on the substrate 10. For example, the convex portion 11 canlimit the second organic layer 17 from overflowing, and the redundant oroverflowed second organic layer 17 may be accommodated in the recess 22and the recess 24. In some embodiments, a portion of the recess 24 iscovered by the second organic layer 17 and another portion of the recess24 is exposed. In other words, a portion of the first organic layer 30and a portion of second organic layer 17 may be disposed in the recess24, and the first inorganic layer 15 direct contacts and overlapping thesecond inorganic layer 16 in the recess 24, but the present disclosureis not limited thereto. Although the second organic layer 17 is disposedon the convex portion 11 and disposed in the recess 22 and the recess 24in FIG. 2 , the present disclosure is not limited thereto. For example,the second organic layer 17 may be not located in the recess 24, or beblocked by the convex portion 11 rather than totally covering the convexportion 11, it depends on design requirements and/or processingparameters.

Because organic light-emitting diode display device is used as anexample in the present disclosure, the electronic element 14 may includeorganic light-emitting diode (OLED) in some embodiments. Alternatively,if the electronic device is other types of display devices, antennadevices or sensing devices, the electronic element 14 may includequantum dot light-emitting diode (QLED/QDLED), light-emitting diodeswhich includes micro light-emitting diode (micro LED) or mini lightemitting diode (mini LED), transceiver unit of the antenna device orsensing unit of the sensing device. In some embodiments, the electronicelement 14 may include thin film transistors, such as top-gate thin filmtransistors, bottom-gate thin film transistors, multi-gate thin filmtransistors, and their channel region may include amorphous silicon, lowtemperature poly-silicon (LTPS), or metal oxide. The thin filmtransistors may be located on the dummy TFT region 1B of the deviceregion 1. In some embodiments, the electronic element 14 may alsoinclude wirings.

In some embodiments, the buffer layer 18 may be disposed over thesubstrate 10, and other elements may be disposed over the buffer layer18. For example, the buffer layer 18 may be disposed between thesubstrate 10 and the inorganic layer I, such as the buffer layer 18 maybe disposed between the substrate 10 and the first inorganic layer 15,or the convex portion 11 or the electronic element 14 may be disposed onthe buffer layer 18. As shown in FIG. 3 , the buffer layer 18 partiallyoverlaps the recess 20 in the normal direction of the substrate 10 (e.g.Z direction). In some embodiments, the buffer layer may be formed byphysical vapor deposition, chemical vapor deposition, coating, othersuitable methods, or a combination thereof. For example, the physicalvapor deposition process may include sputtering, vapor deposition,pulsed layer deposition, etc., but the present disclosure is not limitedthereto. For example, the chemical vapor deposition process may includelow-pressure CVD (LPCVD), low-temperature CVD (LTCVD), rapid-thermal CVD(RTCVD), plasma-enhanced CVD (PECVD), or atomic layer deposition (ALD),but the present disclosure is not limited thereto. It should be notedthat the buffer layer 18 is extruded and partially overlaps the recesses20, so that the first organic layer 30 may be partially embedded in thebuffer layer 18 to further strengthen the structure in the peripheryregion of the display panel.

In some embodiments, the buffer 18 may be formed of insulatingmaterials, but the present disclosure is not limited thereto. Thematerial of the buffer layer 18 may include organic material, inorganicmaterial, or a combination thereof, but the present disclosure is notlimited thereto. The organic material may include polyethyleneterephthalate (PET), polyethylene (PE), polyethersulfone (PES),polycarbonate (PC), polymethylmethacrylate (PMMA), isoprene,phenol-formaldehyde resin, benzocyclobutene (BCB), perfluorocyclobutane(PECB), or a combination thereof, but the present disclosure is notlimited thereto. In some embodiments, the inorganic material may includesilicon oxide, silicon nitride, silicon oxynitride, aluminum oxide,aluminum nitride, aluminum oxynitride, titanium oxide, other suitablematerials, or a combination thereof, but the present disclosure is notlimited thereto.

In some embodiments, the buffer layer 18 may be a single layerstructure. In other embodiments, the buffer layer 18 may include aplurality of sub-layers. In the embodiments where the buffer layer 18includes a plurality of sub-layers, the sub-layers may have identical ordifferent materials, depending on the design requirements.

In some embodiments, the buffer layer 18 may be formed on the substrate10, and then a portion of the buffer layer 18 may be removed bypatterning processes to expose the substrate 10. In some embodiments,the patterning processes may include a photolithography process and anetching process, but the disclosure is not limited thereto. Thephotolithography processes may include photoresist coating (e.g., spincoating), soft baking, hard baking, mask aligning, exposure,post-exposure baking, developing the photoresist, rinsing, drying, oranother suitable process, but the present disclosure is not limitedthereto. The etching process may include dry etching process, but thepresent disclosure is not limited thereto. Afterwards, the exposedsubstrate 10 may be recessed by laser heating to form the recess 20, therecess 22, and the recess 24. Although the recess 20 in FIG. 1 is shownas a groove, the present disclosure is not limited thereto. For example,the recess 20 may include a blind hole or other structure, depending ondesign requirements. In some embodiments, the recess 22 or the recess 24may include a groove that surrounds the device region 1.

FIG. 3 is a cross-sectional view of a recess 20 in some embodiments ofthe present disclosure. In some embodiments, as shown in FIG. 3 , aninterface 21 may be located between the first organic layer 30 and theinorganic layer I (specifically, second inorganic layer 16), and theinterface 21 may include a first part 21A and a second part 21B. Thefirst part 21A may correspond to the side portion 20A, and the firstpart 21A is S-shaped in the cross sectional view, and the second part21B may correspond to the central portion 20B of the recess 20. In otherwords, the first part 21A may be the interface between the secondinorganic layer 16 and the first organic layer 30 at the side portion20A, and the second part 21B may be the interface between the secondinorganic layer 16 and the first organic layer 30 at the central portion20B. In some embodiments, the first part 21A and the second part 21B mayhave curved profiles.

In this disclosure, in a direction that is perpendicular to the normaldirection of the substrate 10 (such as the X direction in FIG. 3 ), theside portions 20A of the recess 20 may be defined as the portions of therecess 20 that have one fifth (⅕) of the total width of the recess 20calculated from the left side and right side of the recess 20, and thecentral portion 20B may be defined as the portion of the recess 20 thatat the central position and has three fifths (⅗) of the total width ofthe recess. For example, as shown in FIG. 3 , the width of each of theside portions 20A at the left side and the right side of the centralportion 20B is respectively one third (⅓) of the width of the centralportion 20B in X direction.

In some embodiments, the curved profile of the first part 21A may belocated in the recess 20, such as a space located between an extendingplane (shown by a dashed line) of a bottom surface 18A of the bufferlayer 18 and a bottom surface 20C of the recess 20. Furthermore, in someembodiments, the curved profile of the first part 21A may be locatedoutside of the recess 20, such as higher than one side of the extendingplane of the bottom surface 18A of the buffer layer 18 in Z direction.The curved profile of the interface 21 (which includes the first part21A and the second part 21B) may reduce the occurrence of turbulent flowwhen disposing the liquid raw material of the first organic layer 30flowing into the recess 20 (no matter the turbulent flow occurs insidethe recess 20 or outside of the recess 20), and the chance to form a gapbetween the first organic layer 30 and the second inorganic layer 16 maybe reduced, the combination of the first organic layer 30 and the secondinorganic layer 16 may be better.

Referring to FIG. 3 , in some embodiments, the thickness T1 of the firstinorganic layer 15 may be greater than the thickness T2 of the secondinorganic layer 16, but the present disclosure is not limited thereto.In some embodiments, the thickness T4 of the inorganic layer I (whichincludes the first inorganic layer 15 and the second inorganic layer 16)at the central portion 20B may be greater than the thickness T3 of theinorganic layer I at the side portion 20A, but the present disclosure isnot limited thereto. For example, the thickness T1 and the thickness T2may be the maximum thicknesses on the buffer layer 18, and may bemeasured in a normal direction of the substrate 10 (e.g., Z direction inFIG. 3 ). In the recess 20, the thickness T3 may be the distancemeasured from the bottom of the inorganic layer I to the top of theinorganic layer at a central point MA, wherein the central point MA is acentral point of a side portion 20A in X direction. Similarly, thethickness T4 may be the distance measured from the bottom of theinorganic layer I to the top portion of the inorganic layer I at acentral point MB of the central portion 20B. It should be noted thatalthough the thickness of the second inorganic layer 16 in FIG. 3 isshown as substantially identical in different positions, but thethickness of the second inorganic layer 16 may change in differentpositions, such as the thickness of the second inorganic layer 16 thatis closer to a side surface 20D of the recess 20 may be less than thethickness of the inorganic layer 16 that corresponds to the centralportion 20B of the recess 20.

FIG. 4 is a cross-sectional view of the recess 22 in some embodiments ofthe present disclosure. In some embodiments, as shown in FIG. 4 , aportion of the first inorganic layer 15 and a portion of the secondorganic layer 17 are disposed in the recess 22, and an interface 23 maybe located between the second organic layer 17 and the first inorganiclayer 15, and the interface 23 may include a first part 23A and a secondpart 23B. The first part 23A may correspond to a side portion 22A of therecess 22, and the second part 23B may correspond to a central portion22B of the recess 22. In other words, the first part 23A may be theinterface between the first inorganic layer 15 and the second organiclayer 17 at the side portion 22A, and the second part 23B may be theinterface between the first inorganic layer 15 and the second organiclayer 17 at the central portion 22B. In some embodiments, the first part23A and the second part 23B may have curved profiles. It should be notedthat no second inorganic layer 16 is disposed in the recess 22. In otherwords, the inorganic layer in the recess 22 may include the firstinorganic layer 15 only.

In this disclosure, in a direction that is perpendicular to the normaldirection of the substrate 10 (such as the X direction in FIG. 4 ), theside portions 22A of the recess 22 may be defined as the portions of therecess 22 that have one fifth of the total width of the recess 22calculated from the left side and right side of the recess 22, and thecentral portion 22B may be defined as the portion of the recess 22 thatat the central and has three fifths of the total width of the recess Forexample, as shown in FIG. 4 , the width of each of the side portions 22Aat the left side and the right side of the central portion 22B isrespectively one third of the width of the central portion 22B in Xdirection.

In some embodiments, the curved profile of the first part 23A may belocated in the recess 22 which is a space located between an extendingplane (shown by a dashed line) of a bottom surface 18A of the bufferlayer 18 and a bottom surface 22C of the recess 22. Furthermore, in someembodiments, the curved profile of the first part 23A may be locatedoutside of the recess 22, such as higher than the bottom surface 18A ofthe buffer layer 18 in Z direction. The curved profile of the interface23 (which includes the first part 23A and the second part 23B) mayreduce the occurrence of turbulent flow when disposing the liquid rawmaterial of the second organic layer 17 flowing into the recess 22 (nomatter the turbulent flow occurs inside the recess 22 or outside of therecess 22), so that the chance to form a gap between the second organiclayer 17 and the first inorganic layer 15 may be reduced, and thecombination of second organic layer 17 and the first inorganic layer 15may be better.

Similar to FIG. 3 , in some embodiments shown in FIG. 4 , the thicknessT6 of the first inorganic layer 15 may be greater than the thickness T5of the first inorganic layer 15, but the present disclosure is notlimited thereto. For example, in the recess 22, the thickness T5 may bethe distance measured from the bottom of the first inorganic layer 15 tothe top of the first inorganic layer 15 at a central point MC, whereinthe central point MC is a central point of a side portion 22A in Xdirection., and the thickness T6 may be the distance measured from thebottom of the first inorganic layer 15 to the top of the first inorganiclayer 15 at a central point MD of the central portion 22B.

It should be noted that as shown in FIG. 2 , the second inorganic layer16 and the first organic layer 30 may be located over the recess 22. Thesecond inorganic layer 16 may be disposed on the second organic layer17, and the first organic layer 30 may be disposed on the secondinorganic layer 16. In other words, the first inorganic layer 15, thesecond organic layer 17, the second inorganic layer 16, and the firstorganic layer 30 may be sequentially arranged in Z direction over therecess 22.

In summary, an electronic device is provided, and particularly to astructure in a periphery region of display panel. The electronic devicemay include a substrate an inorganic layer, and an organic layer. Thesubstrate may have a recess with a side portion. The inorganic layer maybe disposed on the substrate. The organic layer may be disposed on theinorganic layer. The organic layer and the inorganic layer may have aninterface, the interface may include a first part corresponding to theside portion of the recess, and the first part may include a curvedprofile. The curved profile may reduce the occurrence of turbulent flowwhen disposing the liquid raw material of the layers on the substrates,so that the layers may be combined better to strengthen the peripheryregion of the display panel.

The electronic device may have touch-control functionality, to act as atouch-electronic device. Furthermore, the electronic device ortouch-electronic device in the embodiments of the present disclosure maybe applied in any electronic devices with a display screen, such as adisplay, a mobile phone, a watch, a laptop computer, a video camera, acamera, a mobile navigation device, or a television. These are merelyexamples, and the applications of the present disclosure are not limitedthereto. The touch-electronic device of the aforementioned embodimentsof the present disclosure may be applied in an electronic device thathas an antenna, or in other types of electronic devices. Since theaforementioned embodiments in the disclosure may perform substantiallythe same function and obtain substantially the same results, someembodiments of the present disclosure may be combined withoutconflicting with the spirit of the disclosure.

Although embodiments of the present disclosure and their advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims. Moreover, the scope of the present application is not intendedto be limited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosure of the present disclosure,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope of such processes,machines, manufacture, and compositions of matter, means, methods, orsteps. In addition, each claim constitutes a separate embodiment, andthe combination of various claims and embodiments are within the scopeof the disclosure.

What is claimed is:
 1. An electronic device, comprising: a substrate having an edge; an active region located on the substrate; a convex portion disposed between the edge and the active region; a first inorganic layer, disposed on the substrate and the convex portion; a second inorganic layer, disposed on the first inorganic layer, wherein the first inorganic layer directly contacts the second inorganic layer at an end which is located between the convex portion and the edge; and an organic layer, disposed between the first inorganic layer and the second inorganic layer, and between the end and the convex portion.
 2. The electronic device according to claim 1, further comprising a buffer layer disposed between the convex portion and the substrate.
 3. The electronic device according to claim 1, further comprising another organic layer disposed on the second inorganic layer.
 4. The electronic device according to claim 3, wherein a thickness of the another organic layer is greater than a thickness of the second inorganic layer.
 5. The electronic device according to claim 3, wherein the another organic layer is disposed in the active region.
 6. The electronic device according to claim 1, wherein the substrate has a plurality of recesses, and widths of at least two of the plurality of the recesses are different.
 7. The electronic device according to claim 1, wherein the substrate has a plurality of recesses, and the convex portion is disposed between two adjacent ones of the recesses.
 8. The electronic device according to claim 7, wherein the end is located in one of the two adjacent ones of the recesses.
 9. The electronic device according to claim 8, wherein a portion of the organic layer is disposed in the one of the two adjacent ones of the recesses.
 10. The electronic device according to claim 8, wherein a portion of the first inorganic layer is disposed in another one of the two adjacent ones of the recesses and has a curved profile.
 11. The electronic device according to claim 10, wherein the another one of the two adjacent ones of the recesses has a side portion and a central portion, a thickness of the portion of the first inorganic layer in the side portion is less than a thickness of the portion of the first inorganic layer in the central portion. 